STMicroelectronics (STM) has presented at IEDM 2018 architecture and performance benchmarks of a technology based on 28nm FD-SOI with embedded Phase-Change Memory (ePCM) designed for its automotive microcontrollers (MCUs). These MCUs—the world’s first to use ePCM—will target powertrain systems, advanced and secure gateways, safety/ADAS applications, and Vehicle Electrification.
Innovative embedded Phase-Change Memory (ePCM) for automotive MCUs sampling begins.
With more demanding automotive applications, constraints on processing power, power consumption mitigation, and larger memory requirements are pushing for new automotive MCU architectures. One of the most challenging demands is for larger embedded memories as firmware complexity and size increase dramatically. ePCM presents a solution to these chip- and system-level challenges, meeting automotive requirements for AEC-Q100 Grade 0, operating at temperature up to +165°C. In addition, STM’s technology assures firmware/data retention through high-temperature soldering reflow processes and immunity to radiation, for additional data safety.
STM’s products based on ePCM are sampling now to alpha customers, with field trials meeting the requirements of automotive applications and full technology qualification expected in 2020.
“With samples already in some lead-customers’ hands, we’re confirming the outstanding temperature performance of ePCM and its ability to meet all automotive standards, further assuring our confidence in its market adoption and success,” said Marco Monti, President Automotive and Discrete Group, STMicroelectronics.
STM presented an update on the architecture and performance of a 16Mb ePCM array for a 28nm FD-SOI automotive MCU at the 2018 International Electron Devices Meeting (IEDM) in San Francisco on December 4.